William Rowland supply & produce a comprehensive range of both Lead Free & leaded soldering materials for electronics production encompassing through-hole wave/selective/robotic & hand soldering products. SMT materials include cored solder wires and solder pastes.
Soldering is the process of joining two metals by heating them to a temperature where the solder melts and flows together to form a strong bond. It is used in electronics, plumbing, and metalwork to connect or repair metal components. In electronics soldering, a filler metal (solder) with a lower melting point than the base metal is melted and flowed into the joint, filling the gap and creating a permanent bond when it cools and solidifies.
For electronics soldering, lead-free solder is the preferred option due to its lower toxicity and environmental impact compared to traditional lead-based solders. Some common lead-free solders used in electronics are tin-silver-copper (SAC), tin-copper (SnCu), and tin-bismuth (SnBi). The choice of solder depends on various factors, such as the type of component being soldered, operating temperature required for the soldering process, and the desired characteristics of the final joint (e.g. strength, flexibility, wetting etc.). It is important to use the correct type of solder and soldering techniques to ensure reliable and long-lasting connections in electronic circuits.
RoHS compliant Lead-Free high purity solders. Lead based solders manufactured in conjunction with ISO 9001/14001 management systems. Wave solder bath condition analysis facility & dross/scrap solder reclamation service provided.
Surface Mount Technology (SMT) Wave Soldering, Selective Soldering, Robotic Soldering, Hand
Description:
3.25mm Diameter. High purity solid plumbing solder wire suitable for Lead Free hand soldering in all plumbing applications. Lead Free, Meets BS EN 29453 specification & has a melting point of 227-228°C. (Sn99 Cu1).
Available in 250g reels.
Prices shown per kg. (4 x 250g reels per kg)
Other alloys, diameters & cored wires available on request.
Description:
SP-VF.20 No Clean, Lead Free, Type 4 fine pitch Solder Paste for low void performance with defect free soldering & minimal clear residues.
Packaging: 500g jars. (other size packaging, alloys & Type 5 available on request).
Prices per 500g jar.SP-VF.20 No Clean, Lead Free, Type 4 fine pitch Solder Paste for low void performance with defect free soldering & minimal clear residues. Offering long tack time & open pot life. Effective with challenging components & PCB finishes including ENIG, OSP, Ag, Sn & HASL. UK Produced in the UK.
Available in SAC305 alloy 217-220°C. (Sn96.5Ag3.0Cu0.5).
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